USB 3.1 Type C短体母座10.5MM材质说明:

NOTES:

1.MATERIAL

  MOLDING: LCP UL94 V-0

  CONTACT:COPPER 

          GOLD PLATED 30u" Min ON CONTACT AREA,100u'' 

          Min TIN (LEAD FREE) ON SOLDER AREA

SHELL: SUS304-H,T=0.30±0.03mm

       50u" NICKEL PLATING OVER ALL.

SHILD:SUS304-H,T=0.12±0.03mm

2.MECHANICAL:

  INSERTION: 5~20N

  EXTRACTION: 8~20N.

  DURABILITY: 10000 CYCLES

3.ELECTRICAL:

  CURRENT: 5A MIN FOR VBUS

          0.25A MIN FOR OTHER.

  VOLTAGE: 5VAC MAX

  WITHSTANDING VOLTAGE: 100V AC.

  CONTACT RESISTANCE: 40mΩ MAX.

  INSULATION RESISTANCE: 100MΩ MIN.

4.ENVIRONMENTAL

  TEMPERATURE RANGE -55°C ~ +85°C